该系统是集现代计算机软件技术、精密机械制造技术、光学技术、电子技术、传感器技术、无损检测技术和图像处理技术等于一体的高科技产品。它是进行产品研究、失效分析、高可靠筛选、质量评价、工艺改进等工作的有效手段。 该产品技术已获得国家发明**。 This system is a high-tech product integrated with modern computer software technology, precision mechanical technology, optical technology, electronic technology, sensor technology, NDT technology and mage processing technology. It is an efficient means for product research, invalidation analysis, high reliable filtering, quality evaluation and artifact improvement. The technology of this product received the China's National patents. 适用范围 ●适用于BGA、CSP、Flip chip的检测 ●PCB板焊接情况检测 ●各种电池检测 ●IC封装检测 ●电容、电阻等元器件 ●金属材料、介质材料的内部缺陷 ●轻质材料的内部结构以及组件 ●电热管、珍珠、精密器件等 Applying fields ●To inspect BGA,CSP and flip chip ●To inspect the welding of PCB ●To inspect all the kinds of battery ●To inspect IC encapsulation ●To inspect capacitance and resistance ●To inspect the flaw of the metal material and dielectric material ●To inspect the inner structure and groupware of the light material ●To inspect galvanothermy tube, pearl and precision apparatus 图像处理系统主要功能: ●虚拟三维成像,实时放大、缩小; ●灰度优化,实时伪彩,人性化设计; ●电子拍片,多帧叠加,快速便捷; ●支持正/负图像,边缘可增强; ●精确的曲率测量及统计; ●较新的测量工具; ●BGA焊球测量技术; ●可进行角度、半径、焊点面积、气泡面积测量; 气泡所占比例计算;焊点坐标定位及统计; ●动态存储、打印、DVD读写多种输出方式。 Main function of image processing system ●Virtual 3d imaging, real-time imaging magnify and shrink. ●Grayscale optimized, real-time artificial, humanized design ●Electric shoot, many frames congruence, fast and convenience ●Supporting positive and negative imaging, edge strength ●Precise measurement of the curve and statistics ●The new measurement tool ●BGA welding measurement technologies ●Inspection for the angles, semidiameter, welding ball area, air pore, pore proportion and welding ball coordinate and statistic ●Dynamic store, print, DVD read and write and other output methods 主要技术指标●微焦点X射线源 ●管电压调节范围:20kV~160kV ●管电流调节范围:0.1 μA ~100mA ●焦点尺寸:1μm 、5μm、30μm ●系统分辨率:70 LP/cm ●放大倍数:20倍~3000倍 ●检测平台可沿X-Y-Z多轴移动 Main technical parameter ●Micro-focus X-ray source ●Tube voltage range:20kV~160kV ●Tube current range: 0.1 μA ~100mA ●Focus size:1μm, 5μm, 30μm ●High resolution:70 LP/cm ●Magnification:20 times ~3000 times ●The inspect platform can move along x, y and z axes